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Advanced Semiconductor Engineering Inc Stock Dividends Overview

ASX pays dividends yearly. Last paid amount was $0.571 at Aug 03, 2023. As of today, dividend yield (TTM) is 7.49%.

Dividend Yield Range

The Dividend Yield Range is the range of values in which a stock’s dividend yield has fluctuated within a specified period, often a year. It represents the variation between the highest and lowest dividend yields observed during that time frame.
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Key Stats

Dividend Yield (TTM) 7.49%
Frequency Yearly
1Y Growth 0%
Payout Ratio 0
Amount Per Share $0.571
Advanced Semiconductor Engineering Inc has not yet announced its next dividend date. Last payment date was: Aug 03, 2023.

ASX Dividend Payout History

To ensure a understanding of ASX's dividend performance, consider examining the historical payout ratios and how they align with the company's earnings. Fluctuations in payout amounts may reflect changes in the company's dividend policy or earnings stability.


# Declaration Date Ex-Date Pay Date Amount Yield
11 Jul 26, 2013 Jul 26, 2013 Jul 26, 2013 $0.176 5.41%
12 Aug 20, 2012 Aug 20, 2012 Aug 20, 2012 $0.0950 3.24%
13 Aug 12, 2011 Aug 12, 2011 Aug 12, 2011 $0.101 3.18%
14 Jul 27, 2010 Jul 27, 2010 Jul 27, 2010 $0.0510 2.06%
15 Jul 27, 2009 Jul 27, 2009 Jul 27, 2009 $0.0750 3.96%
16 Aug 13, 2008 Aug 13, 2008 Aug 13, 2008 $0.274 12.33%
17 Aug 20, 2007 Aug 20, 2007 Aug 20, 2007 $0.190 7.07%
18 Sep 07, 2005 Sep 07, 2005 Sep 07, 2005 $0.0119 0.750%

Dividend Sustainability

The company's strong Dividend Sustainability Score (DSS) indicates its robust capacity to uphold current dividend levels. Furthermore, its high Dividend Growth Potential Score (DGPS) signals potential dividend growth. In summary, the company provides a promising overall dividend outlook, balancing both sustainability and growth potential.

Sustainability score

Good (71.37%)

Growth potential

Increase likely (48.05%)

ASX Dividend Calculator

Dividend Calculator is designed to forecast the potential returns from ASX dividends based on your individual investment size or the number of shares you own. Simply enter your total investment amount to see the cumulative dividend payment you could receive over a specified period.
Read how to invest in ASX stock here.

Comparing ASX to Sector and Country

ASX pays a solid dividend yield of 7.49%, which is higher than the average of the bottom 25% of dividend payers in the US market (0.322%). ASX’s dividend yield is higher than the average of the top 25% of dividend payers in the Technology sector in the US market (7.44%).

FAQ

What factors can affect the amount of ASX's dividend payments?
The amount of ASX's dividends can fluctuate based on several factors, including the company's financial performance, earnings, cash flow, capital requirements, and overall market conditions. Changes in ASX sector's trends, interest rate shifts, and the company's operational adjustments can also influence dividend decisions.

Can dividends from ASX stock be automatically reinvested?
If ASX offers a Dividend Reinvestment Plan (DRIP), shareholders may have the option to automatically reinvest dividends to purchase additional shares. Please check with your brokerage for the availability and details of such a plan. Here's an easy guide on how to buy ASX stock.

How often does ASX pay dividend?
Advanced Semiconductor Engineering Inc (ASX) pays dividends yearly. The most recent payout was on Aug 03, 2023.

How much does ASX pays per share?
The last recorder (Jun 30, 2023) dividend per share was $0.571.

What is ASX dividend growth rate?
Over the last year, Advanced Semiconductor Engineering Inc has witnessed growth rate of 0% . Looking back over the past 3 years, this growth rate has been 23.65%. Furthermore, examining the past 5 years, Advanced Semiconductor Engineering Inc has maintained an average Dividends Per Share Growth Rate of 33.24%.
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About Advanced Semiconductor Engineering Inc

Advanced Semiconductor Engineering ASE Technology Holding Co., Ltd. provides a range of semiconductors packaging and testing, and electronic manufacturing services in the United States, Taiwan, rest of Asia, Europe, and internationally. It offers packaging services, including flip chip ball grid array (BGA) and chip scale package (CSP), advanced chip scale packages, quad flat packages, low profile and thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages,... ASX Profile

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