HC SemiTek Corp Stock Dividends
300323.SZ used to pay dividends yearly. Last paid amount was ¥0.0450 at Jul 19, 2019. As of today, dividend yield (TTM) is 0%.
Dividend Yield Range
Dividend Analysis | Generate |
Key Stats
Dividend Yield (TTM) | 0% |
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Frequency | Yearly |
1Y Growth | 0% |
Payout Ratio | 0 |
Amount Per Share | ¥0.0450 |
HC SemiTek Corp has not yet announced its next dividend date. Last payment date was: Jul 19, 2019.
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300323 Dividend Payout History
To ensure a understanding of 300323's dividend performance, consider examining the historical payout ratios and how they align with the company's earnings. Fluctuations in payout amounts may reflect changes in the company's dividend policy or earnings stability.
# | Ex-Date | Pay Date | Amount | Yield | |
---|---|---|---|---|---|
1 | Jul 19, 2019 | Jul 19, 2019 | Jul 19, 2019 | ¥0.0450 | 0.791% |
2 | Jul 20, 2018 | Jul 20, 2018 | Jul 20, 2018 | ¥0.0950 | 0.699% |
3 | May 17, 2017 | May 17, 2017 | May 17, 2017 | ¥0.0500 | 0.365% |
4 | Jul 04, 2013 | Jul 04, 2013 | Jul 04, 2013 | ¥0.0296 | 0.87% |
Dividend Sustainability
The company's low Dividend Sustainability Score (DSS) highlights potential challenges in upholding its current dividend levels. Unfortunately, its low Dividend Growth Potential Score (DGPS) suggests limited prospects for dividend growth. In conclusion, a more vigilant stance is recommended given the company's tentative dividend landscape.