HEIAN CEREMONY SERVICE CO.,LTD. Stock Dividends
2344.T used to pay dividends biannually. Last paid amount was JP¥15.00 at Mar 30, 2023. As of today, dividend yield (TTM) is 0%.
Dividend Yield Range
AI Analysis of 2344.T
| Dividend Analysis | Generate |
Key Stats
| Dividend Yield (TTM) | 0% |
|---|---|
| Frequency | Biannually |
| 1Y Growth | 0% |
| Payout Ratio | 0 |
| Amount Per Share | JP¥15.00 |
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HEIAN CEREMONY SERVICE CO.,LTD. has not yet announced its next dividend date. Last payment date was: Mar 30, 2023.
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2344 Dividend Payout History
To ensure a understanding of 2344's dividend performance, consider examining the historical payout ratios and how they align with the company's earnings. Fluctuations in payout amounts may reflect changes in the company's dividend policy or earnings stability.
| # | Ex-Date | Pay Date | Amount | Yield | |
|---|---|---|---|---|---|
| 1 | Mar 30, 2023 | Mar 30, 2023 | Mar 30, 2023 | JP¥15.00 | 2.04% |
| 2 | Sep 29, 2022 | Sep 29, 2022 | Sep 29, 2022 | JP¥13.00 | 1.70% |
| 3 | Mar 30, 2022 | Mar 30, 2022 | Mar 30, 2022 | JP¥14.00 | 1.71% |
| 4 | Sep 29, 2021 | Sep 29, 2021 | Sep 29, 2021 | JP¥13.00 | 1.45% |
| 5 | Mar 30, 2021 | Mar 30, 2021 | Mar 30, 2021 | JP¥14.00 | 1.59% |
| 6 | Sep 29, 2020 | Sep 29, 2020 | Sep 29, 2020 | JP¥13.00 | 1.58% |
| 7 | Mar 30, 2020 | Mar 30, 2020 | Mar 30, 2020 | JP¥14.00 | 1.80% |
| 8 | Sep 27, 2019 | Sep 27, 2019 | Sep 27, 2019 | JP¥13.00 | 1.55% |
| 9 | Mar 27, 2019 | Mar 27, 2019 | Mar 27, 2019 | JP¥12.00 | 1.35% |
| 10 | Sep 26, 2018 | Sep 26, 2018 | Sep 26, 2018 | JP¥4.00 | 0.452% |
Dividend Sustainability
With a moderate Dividend Sustainability Score (DSS), the company may sustain its dividends, but continuous monitoring is advised for any financial shifts. However, its Dividend Growth Potential Score (DGPS) is only moderate, indicating limited growth potential. On the whole, the dividend outlook remains neutral, meriting close observation of both the company's financial health and growth prospects.
