Sign In
Buy BESIY
BE Semiconductor Industrs NV (USA) Earnings Calls
| Release date | Jul 23, 2026 |
| EPS estimate | $1.30 |
| EPS actual | $1.29 |
| EPS Surprise | -0.769% |
| Revenue estimate | 285.576M |
| Revenue actual | 284.123M |
| Revenue Surprise | -0.509% |
| Release date | Apr 23, 2026 |
| EPS estimate | $0.740 |
| EPS actual | $0.760 |
| EPS Surprise | 2.70% |
| Revenue estimate | 218.379M |
| Revenue actual | 216.512M |
| Revenue Surprise | -0.86% |
| Release date | Feb 19, 2026 |
| EPS estimate | $0.588 |
| EPS actual | $0.630 |
| EPS Surprise | 7.14% |
| Revenue estimate | 191.148M |
| Revenue actual | 195.674M |
| Revenue Surprise | 2.37% |
| Release date | Oct 23, 2025 |
| EPS estimate | $0.310 |
| EPS actual | $0.370 |
| EPS Surprise | 19.35% |
| Revenue estimate | 163.308M |
| Revenue actual | 154.154M |
| Revenue Surprise | -5.61% |
Last 4 Quarters for BE Semiconductor Industrs NV (USA)
Below you can see how BESIY performed 4 days prior and 4 days after releasing the earnings report. Also, you can see the pre-estimates and the actual earnings. This information can give you a slight idea of what you might expect for the next quarter's release.
| Release date | Oct 23, 2025 |
| Price on release | $166.42 |
| EPS estimate | $0.310 |
| EPS actual | $0.370 |
| EPS surprise | 19.35% |
| Date | Price |
|---|---|
| Oct 17, 2025 | $167.34 |
| Oct 20, 2025 | $167.34 |
| Oct 21, 2025 | $166.45 |
| Oct 22, 2025 | $159.63 |
| Oct 23, 2025 | $166.42 |
| Oct 24, 2025 | $172.33 |
| Oct 27, 2025 | $171.35 |
| Oct 28, 2025 | $171.40 |
| Oct 29, 2025 | $171.08 |
| 4 days before | -0.550% |
| 4 days after | 2.80% |
| On release day | 3.55% |
| Change in period | 2.23% |
| Release date | Feb 19, 2026 |
| Price on release | $205.64 |
| EPS estimate | $0.588 |
| EPS actual | $0.630 |
| EPS surprise | 7.14% |
| Date | Price |
|---|---|
| Feb 12, 2026 | $201.12 |
| Feb 13, 2026 | $210.50 |
| Feb 17, 2026 | $215.00 |
| Feb 18, 2026 | $222.50 |
| Feb 19, 2026 | $205.64 |
| Feb 20, 2026 | $223.95 |
| Feb 23, 2026 | $223.95 |
| Feb 24, 2026 | $232.76 |
| Feb 25, 2026 | $234.99 |
| 4 days before | 2.25% |
| 4 days after | 14.27% |
| On release day | 8.90% |
| Change in period | 16.84% |
| Release date | Apr 23, 2026 |
| Price on release | $282.00 |
| EPS estimate | $0.740 |
| EPS actual | $0.760 |
| EPS surprise | 2.70% |
| Date | Price |
|---|---|
| Apr 17, 2026 | $270.00 |
| Apr 20, 2026 | $273.40 |
| Apr 21, 2026 | $269.98 |
| Apr 22, 2026 | $283.00 |
| Apr 23, 2026 | $282.00 |
| Apr 24, 2026 | $298.10 |
| Apr 27, 2026 | $294.53 |
| Apr 28, 2026 | $278.50 |
| Apr 29, 2026 | $278.79 |
| 4 days before | 4.44% |
| 4 days after | -1.14% |
| On release day | 5.71% |
| Change in period | 3.26% |
| Release date | Jul 23, 2026 |
| Price on release | $260.01 |
| EPS estimate | $1.30 |
| EPS actual | $1.29 |
| EPS surprise | -0.769% |
| Date | Price |
|---|---|
| Jul 17, 2026 | $257.23 |
| Jul 20, 2026 | $254.50 |
| Jul 21, 2026 | $273.98 |
| Jul 22, 2026 | $283.80 |
| Jul 23, 2026 | $260.01 |
| Jul 24, 2026 | $256.25 |
| Jul 27, 2026 | $236.64 |
| Jul 28, 2026 | $226.18 |
| Jul 29, 2026 | $214.86 |
| 4 days before | 1.08% |
| 4 days after | -17.36% |
| On release day | -1.45% |
| Change in period | -16.47% |
BE Semiconductor Industrs NV (USA) Earnings Call Transcript Summary of Q2 2026
Besi reported a very strong Q2 and H1 2026 driven by AI-related demand and renewed strength in mobile: Q2 revenue was EUR 249.9m (+68.7% YoY, +35.2% QoQ); orders in Q2 were EUR 292.9m (+128.8% YoY); trailing-12-month orders reached a record EUR 987.6m. Q2 net income was EUR 89m (net margin 35.6% vs 21.6% a year ago); H1 net margin rose to 32.3%. Cash improved to EUR 164m following convertible conversion and strong operating cash flow. Key demand drivers are AI infrastructure (photonics, data center, hybrid bonding for logic and memory), CoWoS/CoWoS-like and photonics, plus early recovery in high-end smartphones. Hybrid bonding customer adoption rose to 21 customers (from 15 at year-end 2025), with multiple evaluations underway at major memory players. Besi expects Q3 2026 revenue to grow 10–15% sequentially; gross margin to moderate to 63–65% due to mix; operating expenses flat to +5% as development spend increases. Management emphasized disciplined expense and supply-chain management, progress on wafer-level assembly (hybrid bonding and TC Next), and potential risks around technology qualification (yield & cost), cyclical overcapacity, and the timing of broad adoption of hybrid bonding in memory. Overall tone: optimistic on a multiyear AI-driven cycle, while noting the usual qualification and cyclicality risks.
