Be Semiconductor Industrs Nv (usa) Stock Earnings Reports

Besi reported Q3 2025 results largely in line with guidance with improving order momentum despite revenue declines versus prior periods. Bookings rose to EUR 174.7m (up 36.5% vs Q2 and 15.1% vs Q3 2024), driven by broad-based die-attach demand from Asian OSATs for 2.5D/data-center applications and renewed photonics (pluggable) capacity purchases. Revenue fell (reflecting weakness in mainstream mobile and automotive and lower hybrid-bonding revenue) and YTD net income declined due to lower revenue, adverse FX on gross margin, and higher interest expense. Liquidity remains strong (cash/deposits EUR 518.6m) and Besi completed a EUR 100m buyback and authorized a new EUR 60m program. Management sees early signs of market recovery and expects to outgrow the broader assembly market because of leadership in advanced packaging. Key technology progress: hybrid-bonding adoption is expanding (additional foundry customer orders and continued TC Next progress), with customers evaluating HBM and logic hybrid bonding; Besi is shipping 100 nm systems now and will ship 50 nm evaluation units toward year-end, with a roadmap for next-generation accuracy. For Q4 2025 Besi guides revenue to increase ~15%–25% vs Q3, gross margin of 61%–63%, and opex +5%–10% (R&D-driven). Management expects continued order momentum into Q4 and highlights 2026 as a pivotal growth/ adoption year for hybrid bonding and HBM stacking, with potential upside from AI/data-center driven advanced packaging demand and geographic capacity shifts (e.g., India, Vietnam).