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Range Low Price High Price Comment
30 days $126.61 $156.87 Friday, 10th May 2024 BESIY stock ended at $144.45. This is 2.41% more than the trading day before Thursday, 9th May 2024. During the day the stock fluctuated 0.98% from a day low at $143.75 to a day high of $145.16.
90 days $126.61 $195.34
52 weeks $89.16 $195.34

Historical BE Semiconductor Industrs NV (USA) prices

Date Open High Low Close Volume
May 10, 2024 $144.87 $145.16 $143.75 $144.45 7 961
May 09, 2024 $141.35 $141.35 $141.05 $141.05 793
May 08, 2024 $135.30 $136.40 $135.30 $136.19 2 150
May 07, 2024 $137.52 $137.52 $137.52 $137.52 355
May 06, 2024 $136.50 $137.37 $136.50 $137.37 1 383
May 03, 2024 $133.67 $137.40 $133.67 $136.21 3 496
May 02, 2024 $129.92 $131.21 $126.61 $131.10 6 113
May 01, 2024 $135.09 $135.09 $130.70 $133.65 1 386
Apr 30, 2024 $136.00 $136.00 $135.36 $135.36 1 492
Apr 29, 2024 $135.69 $136.70 $133.78 $135.32 1 772
Apr 26, 2024 $138.75 $142.55 $138.75 $142.54 1 641
Apr 25, 2024 $147.58 $148.84 $147.58 $148.84 588
Apr 24, 2024 $149.87 $149.87 $149.87 $149.87 540
Apr 23, 2024 $142.90 $144.86 $142.90 $144.86 1 131
Apr 22, 2024 $140.00 $142.23 $138.09 $140.51 1 805
Apr 19, 2024 $143.32 $145.03 $141.80 $141.80 1 355
Apr 18, 2024 $147.61 $147.61 $145.30 $145.43 1 346
Apr 17, 2024 $152.65 $152.65 $151.07 $151.07 1 379
Apr 16, 2024 $152.28 $152.58 $150.59 $152.58 1 308
Apr 15, 2024 $152.05 $152.05 $149.43 $149.43 851
Apr 12, 2024 $153.50 $153.50 $153.00 $153.00 906
Apr 11, 2024 $152.36 $156.25 $152.36 $156.25 5 773
Apr 10, 2024 $156.87 $156.87 $155.96 $156.20 1 278
Apr 09, 2024 $161.50 $161.50 $158.25 $158.25 509
Apr 08, 2024 $164.82 $164.82 $164.82 $164.82 0
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About BE Semiconductor Industrs NV (USA)

BE Semiconductor Industrs NV (USA) BE Semiconductor Industries N.V. develops, manufactures, markets, sells, and services semiconductor assembly equipment for the semiconductor and electronics industries worldwide. The company's principal products include die attach equipment, such as single chip, multi chip, multi module, flip chip, thermal compression bonding, fan out wafer level packaging, hybrid and embedded bridge die bonding, and die sorting systems; and packaging equipment, ... BESIY Profile

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