3750.HK Dividends Insights
3750.HK pays dividends semiannually. Last paid amount was HK$7.88 at May 14, 2026. As of today, dividend yield (TTM) is 1.63%.
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Safety Rating
Built on AI-powered analysis of yield strength, recent news, payout trends, and 10-year dividend growth consistency.
Dividend Yield Range
| Dividend Analysis |
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Key Stats
| Dividend Yield (TTM) | 1.63% |
|---|---|
| Frequency | Semiannually |
| 1Y Growth | 47.55% |
| Payout Ratio | 0 |
| Amount Per Share | HK$1.63 |
| Next Ex-Dividend Date | Aug 06, 2026 |
| Next Payment Date | Sep 03, 2026 |
3750 Dividend Payout History
To ensure a understanding of 3750's dividend performance, consider examining the historical payout ratios and how they align with the company's earnings. Fluctuations in payout amounts may reflect changes in the company's dividend policy or earnings stability.
| # | Ex-Date | Pay Date | Amount | Yield | |
|---|---|---|---|---|---|
| 1 | Aug 06, 2026 | Aug 06, 2026 | Sep 03, 2026 | HK$1.63 | 0.263% |
| 2 | Apr 10, 2026 | Apr 10, 2026 | May 14, 2026 | HK$7.88 | 1.29% |
| 3 | Aug 12, 2025 | Aug 12, 2025 | Sep 15, 2025 | HK$1.10 | 0.274% |
Dividend Sustainability
The company's strong Dividend Sustainability Score (DSS) indicates its robust capacity to uphold current dividend levels. Its Dividend Growth Potential Score (DGPS) is moderate, indicating limited growth potential. Overall, the dividend outlook is mixed, and merits close monitoring of both financial strength and growth prospects.
DSS - Sustainability score
DSGP - Growth potential
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